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This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20201
Silicon PNP epitaxial planar type
For general amplification Features Package
Code Mini5-G3-B Name Pin 1: Emitter (Tr1) 2: Base (Common) 3: Emitter (Tr2)
Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package
Basic Part Number
Dual DSA2001 (Common Base)
4: Collector (Tr2) 5: Collector (Tr1)
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Marking Symbol: A5 Internal Connection
Absolute Maximum Ratings Ta = 25C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP PT Tj Tstg Rating -60 -50 -7 -100 -200 300 150 -55 to +150 Unit V V V mA mA mW C C
(C1) 5
(C2) 4
Tr1
Tr2
1 (E1)
2 (B)
3 (E2)
Electrical Characteristics Ta = 25C3C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Forward current transfer ratio hFE ratio * Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) Symbol VCBO VCEO VEBO ICBO ICEO hFE hFE (Small/Large) VCE(sat) fT Cob Conditions IC = -10 A, IE = 0 IC = -2 mA, IB = 0 IE = -10 A, IC = 0 VCB = -20 V, IE = 0 VCE = -10 V, IB = 0 VCE = -10 V, IC = -2 mA VCE = -10 V, IC = -2 mA IC = -100 mA, IB = -10 mA VCE = -10 V, IC = -2 mA VCB = -10 V, IE = 0, f = 1 MHz 210 0.50 0.99 - 0.2 150 2 - 0.5 Min -60 -50 -7 - 0.1 -100 460 Typ Max Unit V V V A A V MHz pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Ratio between 2 elements
Publication date: February 2010
ZJJ00532BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20201
DMA20201_PT-Ta DMA20201_IC-VCE DMA20201_hFE-IC
600
PT Ta
400 -120 Ta = 25C
IC VCE
IB = -600 A -500 A -400 A -60 -40 -20 -300 A -200 A -100 A
hFE IC
VCE = -10 V
Total power dissipation PT (mW)
300
Forward current transfer ratio hFE
-100
500 400 300 25C 200 100 0 - 0.1 -30C
Collector current IC (mA)
-80
Ta = 85C
200
100
0
0
40
80
120
160
200
0
0
-2
-4
-6
-8
-10
-12
-1
-10
-100
Ambient temperature Ta (C)
DMA20201_VCEsat-IC
Collector-emitter voltage VCE (V)
DMA20201_IC-VBE
Collector current IC (mA)
DMA20201_Cob-VCB
VCE(sat) IC
Collector-emitter saturation voltage VCE(sat) (V)
-10 IC / IB = 10 120 100 VCE = 10 V
IC VBE
Collector output capacitance (Common base, input open circuited) Cob (pF)
25C Ta = 85C 80 60 40 20 0 -30C 4.0
Cob VCB
IE = 0 f =1 MHz Ta = 25C
Collector current IC (mA)
-1
3.0
2.0
- 0.1
Ta = 85C -30C 25C -1 -10 -100
1.0
- 0.01 - 0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
0
1
10
100
Collector current IC (mA)
DMA20201_fT-IC
Base-emitter voltage VBE (V)
Collector-base voltage VCB (V)
fT IC
250 VCE = -10 V Ta = 25C
Transition frequency fT (MHz)
200
150
100
50
0 0.1
1
10
100
Collector current IC (mA)
2
ZJJ00532BED
This product complies with the RoHS Directive (EU 2002/95/EC).
DMA20201
Mini5-G3-B
Unit: mm
0.30
+0.10 -0.05
(0.65)
0.13
+0.05 -0.02
5
4
+0.25 -0.05
1.50
2.8
+0.2 -0.3
1
2
3
(0.95)
(0.95) 1.9 0.1
2.90
+0.20 -0.05
8
+0.2
0 to 0.1
+0.3 1.1 -0.1
1.1 -0.1
0.4 0.2
6
ZJJ00532BED
3
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805

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